 |
|
| If you can't view the Datasheet, Please click here to try to view without PDF Reader . |
|
|
|
| If you can't view the Datasheet, Please click here to try to view without PDF Reader . |
|
|
| Datasheet File OCR Text: |
| HI-SINCERITY MICROELECTRONICS CORP. Spec. No. : HE6413 Issued Date : 1993.01.15 Revised Date : 2002.02.05 Page No. : 1/4 HBC327 PNP EPITAXIAL PLANAR TRANSISTOR Description This HBC327 is designed for driver and output-stages of audio amplifiers. Features * High DC Current Gain: 100-600 at IC=100mA,VCE=1V * Complementary to HBC337 TO-92 Absolute Maximum Ratings * Maximum Temperatures Storage Temperature ............................................................................................ -55 ~ +150 C Junction Temperature .................................................................................... +150 C Maximum * Maximum Power Dissipation Total Power Dissipation (Ta=25C) ................................................................................ 625 mW * Maximum Voltages and Currents (Ta=25C) VCBO Collector to Base Voltage ........................................................................................ -50 V VCEO Collector to Emitter Voltage ..................................................................................... -45 V VEBO Emitter to Base Voltage ............................................................................................. -5 V IC Collector Current ...................................................................................................... -500 mA Characteristics (Ta=25C) Symbol BVCBO BVCEO BVEBO ICBO IEBO *hFE1 *hFE2 *VCE(sat)1 VBE(on) fT Cob Min. -50 -45 -5 100 40 Typ. 100 4 Max. -100 -100 600 -0.7 -1.2 Unit V V V nA nA Test Conditions IC=-100uA, IE=0 IC=-10mA, IB=0 IE=-100uA, IC=0 VCB=-30V, IE=0 VEB=-5V, IC=0 VCE=-1V, IC=-100Ma VCE=-1V, IC=-300mA IC=-500mA, IB=-50mA VCE=-1V, IC=-300mA, VCE=-5V, IC=-10mA, f=100MHZ VCB=-10V, f=1MHZ, IC=0 V V MHZ PF *Pulse Test: Pulse Width 380us, Duty Cycle2% Classification of hFE1 Rank Range 16 100-250 25 160-400 40 250-600 HBC327 HSMC Product Specification HI-SINCERITY MICROELECTRONICS CORP. Characteristics Curve Current Gain & Collector Current 1000 1000 VCE(sat) @ IC=10IB Spec. No. : HE6413 Issued Date : 1993.01.15 Revised Date : 2002.02.05 Page No. : 2/4 Saturation Voltage & Collector Current 125 C o 100 25 C o Saturation Voltage (mV) hFE 75 C o 100 125 C o o hFE @ VCE=1V 10 1 10 100 1000 10 0.1 1 25 C 75 C o 10 100 1000 Collector Current-IC (mA) Collector Current-IC (mA) ON Voltage & Collector Current 1000 25 C o Cutoff Frequency & Collector Current 1000 Cutoff Frequency (MHz).. . ON Voltage (mV) 75 C 125 C o o VCE=5V 100 VBE(ON) @ VCE=1V 100 0.1 1 10 100 1000 10 1 10 100 1000 Collector Current-IC (mA) Collector Current (mA) Capacitance & Reverse-Biased Voltage 100 10000 Safe Operating Area PT=100ms PT=1ms Collector Current-IC (mA) 1000 PT=1s Capacitance (pF) Cob 10 100 10 1 0.1 1 10 100 1 1 10 100 Reverse Biased Voltage (V) Forward Voltage-VCE (V) HBC327 HSMC Product Specification HI-SINCERITY MICROELECTRONICS CORP. Spec. No. : HE6413 Issued Date : 1993.01.15 Revised Date : 2002.02.05 Page No. : 3/4 PD-Ta 700 600 Power Dissipation-PD (mW) 500 400 300 200 100 0 0 50 100 o 150 200 Ambient Temperature-Ta ( C) HBC327 HSMC Product Specification HI-SINCERITY MICROELECTRONICS CORP. TO-92 Dimension A B 1 2 3 Date Code Spec. No. : HE6413 Issued Date : 1993.01.15 Revised Date : 2002.02.05 Page No. : 4/4 2 Marking: H BC 327 Control Code 3 C Style: Pin 1.Collector 2.Base 3.Emitter D H I E F G 1 3-Lead TO-92 Plastic Package HSMC Package Code: A *: Typical DIM A B C D E F Inches Min. Max. 0.1704 0.1902 0.1704 0.1902 0.5000 0.0142 0.0220 *0.0500 0.1323 0.1480 Millimeters Min. Max. 4.33 4.83 4.33 4.83 12.70 0.36 0.56 *1.27 3.36 3.76 DIM G H I 1 2 3 Inches Min. Max. 0.0142 0.0220 *0.1000 *0.0500 *5 *2 *2 Millimeters Min. Max. 0.36 0.56 *2.54 *1.27 *5 *2 *2 Notes: 1.Dimension and tolerance based on our Spec. dated Apr. 25,1996. 2.Controlling dimension: millimeters. 3.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material. 4.If there is any question with packing specification or packing method, please contact your local HSMC sales office. Material: * Lead: 42 Alloy; solder plating * Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0 Important Notice: * All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of HSMC. * HSMC reserves the right to make changes to its products without notice. * HSMC semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems. * HSMC assumes no liability for any consequence of customer product design, infringement of patents, or application assistance. Head Office And Factory: * Head Office (Hi-Sincerity Microelectronics Corp.): 10F.,No. 61, Sec. 2, Chung-Shan N. Rd. Taipei Taiwan R.O.C. Tel: 886-2-25212056 Fax: 886-2-25632712, 25368454 * Factory 1: No. 38, Kuang Fu S. Rd., Fu-Kou Hsin-Chu Industrial Park Hsin-Chu Taiwan. R.O.C Tel: 886-3-5983621~5 Fax: 886-3-5982931 HBC327 HSMC Product Specification |
Price & Availability of HBC327
 |
|
|
|
|
All Rights Reserved © IC-ON-LINE 2003 - 2022 |
| [Add Bookmark] [Contact Us] [Link exchange] [Privacy policy] |
|
Mirror Sites : [www.datasheet.hk]
[www.maxim4u.com] [www.ic-on-line.cn]
[www.ic-on-line.com] [www.ic-on-line.net]
[www.alldatasheet.com.cn]
[www.gdcy.com]
[www.gdcy.net] |